By Dimitris Gizopoulos
This is a brand new kind of edited quantity within the Frontiers in digital trying out ebook sequence dedicated to fresh advances in digital circuits trying out. The ebook is a entire elaboration on vital issues which catch significant examine and improvement efforts at the present time. "Hot" issues of present curiosity to check expertise group were chosen, and the authors are key participants within the corresponding topics.
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Extra resources for Advances in Electronic Testing: Challenges and Methodologies
A bridging fault obtained by inductive fault analysis  assumes only that the lines are connected somehow. Specific simulation algorithms make additional assumptions about bridge resistance and logic behavior. Virtually all bridging approaches assume that the entire line AB is at the same voltage. However, circuit wires are in general complicated RLC structures, and there is no guarantee that the constant voltage assumption will hold true, particularly at high frequencies. The “critical resistance” of the defect (the resistance above which the defect cannot be detected) will depend on the maximum frequency that can be measured by a given test.
A fourth category will not be detectable by either 1 or 2, but could be detected by another approach. Ideally, it would be desirable to model defects directly and independently from the methods used to detect them, but realistically 6 defect behavior must be extrapolated and simplified into fault models . The factors affecting fault modeling in nanometer technologies can be divided into three broad categories: increasing circuit size, increasing defect subtlety, and decreasing numbers of manufacturing processes.
The stuck-open model is one example of a fault model targeted at open defects, but it has not found to be representative of many actual CMOS defects, even in current geometries. Because predicting the behavior of opens is so difficult and error-prone, it is likely that test methods that target opens implicitly, such as delay tests or current tests, will be more successful than explicit open models. Future Directions As mentioned earlier, partial opens due to copper voiding are a common defect 9 mechanism at 130nm.
Advances in Electronic Testing: Challenges and Methodologies by Dimitris Gizopoulos